SMDs (and even through hole components) can be taken off with a heat gun. You have to take care not to overheat the components, but it's worked well for me. Just heat the area of the board and use tiny tweezers to test whether the component has come free or not. Once the solder has started to melt, remove the component from the solder pads immediately so as to not overheat it. Its pretty much the only way to get SMD ICs off a board without damaging the leads.