I plan on using a couple of L293E ICs for motor drivers. Everything I've read suggests heat sinking, and I can understand why, with all that current going though a little IC circuit. But how do you heat sink a DIP IC?
I have many guesses. On top? Sounds wrong. Plus the L293 documentation notes that there are 4 ground pins in the center (pins 5, 6, 15, and 16 in a 20 pin package) for heat sinking purposes. Where exactly do you put the heat sink and how is it attached?