Author Topic: Heat sinking ICs  (Read 3294 times)

0 Members and 1 Guest are viewing this topic.

Offline JoeTopic starter

  • Full Member
  • ***
  • Posts: 54
  • Helpful? 0
Heat sinking ICs
« on: January 23, 2007, 07:07:09 PM »
I plan on using a couple of L293E ICs for motor drivers. Everything I've read suggests heat sinking, and I can understand why, with all that current going though a little IC circuit. But how do you heat sink a DIP IC?

I have many guesses. On top? Sounds wrong. Plus the L293 documentation notes that there are 4 ground pins in the center (pins 5, 6, 15, and 16 in a 20 pin package) for heat sinking purposes. Where exactly do you put the heat sink and how is it attached?

Offline Admin

  • Administrator
  • Supreme Robot
  • *****
  • Posts: 11,702
  • Helpful? 173
    • Society of Robots
Re: Heat sinking ICs
« Reply #1 on: January 24, 2007, 08:51:13 PM »
i looked up the datasheet for the L293E here:

on the first page it says 'use the four center pins to conduct heat to the printed circuit board' :P

this type of IC isnt designed for heatsinks, and instead uses the pins to get rid of heat


Get Your Ad Here